Showing 1 - 10 of 20
20
| Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets | MSDS (US) |
|---|---|---|---|---|---|---|---|
| CoolTherm ® EP-6150 Epoxy Adhesive |
145,000 |
0.6 |
 |
||||
| CoolTherm ® EP-6151 Epoxy Adhesive |
750,000 |
0.6 |
124 |
|
|||
| CoolTherm ® EP-6960 Conductive Adhesive |
150,000 |
1.1 |
49 |
|
|||
| Thermoset EP-729 Board Level Encapsulant |
58,000 |
140 |
|
||||
| Thermoset EP-937 Board Level Encapsulant | 47,900 | 125 |
|
|
|||
| Thermoset EP-939 Board Level Encapsulant |
37,200 |
125 |
|
||||
| CoolTherm ® EP-96 Epoxy Adhesive |
145,000 |
30 min @ 121°C; or |
0.6 |
141 |
|
||
| Thermoset MD-130 Adhesive |
60,000 |
0.42 | 140 |
|
|||
| CoolTherm ® MD-140 SP Conductive Adhesive |
40,000 |
12 |
82 |
|
|||
| CoolTherm ® MD-161 Conductive Adhesive |
40,000 |
1.9 |
55 |
|