Thermoset MD-130 Adhesive Where to Buy
Product Information
LORD Thermoset MD-130 adhesive is a one-component, microelectronic grade adhesive designed for a variety of semiconductor IC packaging applications where electrical conductivity is not required.
Shelf Life
Shelf life is six months from date of manufacture when stored between 0°C and 5°C in original, unopened container. Syringe must be maintained in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
Features and Benefits
Fast Cure – quickly cures at temperatures down to 100°C, leaving no pits or voids for a smooth surface.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55 to +130°C.
Excellent Stability – provides long room temperature stability and high shear strength.
Uncured Typical Properties*
| Appearance | Black Paste |
|
Viscosity, cps @ 25°C Spindle 14, 1 rpm |
60,000 |
| Specific Gravity | 1.49 |
|
Gel Time, min @ 150°C 1.00 g mass in oven |
2 |
| Working Life, month @ 25°C | 6 |
| Cure Time |
8-24 min @ 150°C; or 160 min @ 100°C |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 1 x 1015 |
| Thermal Conductivity, W/mK @ 25°C | 0.42 |
|
Coefficient of Linear Thermal Expansion, ppm/°C below Tg |
35 |
| Glass Transition Temperature (Tg), °C | 140 |
| Hardness, Shore D | 88 |
| Die Shear Strength, psi | 8200 |
| Elongation at Break, % | 1.7 |
| Storage Modulus, MPa @ 25°C | 1706 |
| Dielectric Constant | 4.2 |
| Dissipation Factor | 0.008 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
 |
Technical Data Sheet | Thermoset MD-130 Adhesive | |
|
|
User Instructions | Electronic Materials Handling Instructions (5°C Storage Temperature) |