CoolTherm® MD-140 SP Conductive Adhesive Where to Buy
Product Information
LORD CoolTherm® MD-140 SP silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly. CoolTherm MD-140 SP adhesive is low stress, making it suitable for use with large die.
CoolTherm MD-140 SP adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications.
Shelf Life
Shelf life is six months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions† for thawing.
† Handling instructions are available on LORD.com.
Features and Benefits
Convenient – provides a working life of up to 72 hours after loading a syringe into the dispensing equipment at room temperature.
Excellent Dispensability – allows high-speed, accurate syringe dispensing of fine dots or lines; can be used with time/pressure, positive displacement or linear dispense heads.
Fast Cure – rapidly cures at 150°C and 180°C.
Uncured Typical Properties*
| Appearance | Silver Paste |
| Viscosity, cps @ 25°C | 40,000 |
| Specific Gravity | 3.7 |
| Cure Time |
5-10 min @ 120°C; or 3-5 min @ 150°C; or 1-3 min @ 180°C |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 0.0001 |
| Thermal Conductivity**, W/m·K | 12 |
| Coefficient of Linear Thermal Expansion, ppm/°C |
alpha 1 = 60 alpha 2 = 190 |
| Glass Transition Temperature (Tg), °C | 82 |
| Die Shear Strength, MPa (psi) @ 25°C | 56.4 (8200) |
| Storage Modulus, MPa @ 25°C | 3300 |
| Extractable Ionic Contaminants, ppm |
Chloride = < 50 Sodium = < 5 Potassium = < 1 |
*Data is typical and not to be used for specification purposes.
**Cure for analysis 2 hours at 150°C. Measured by Laser Flash method.
Literature
| Download | Type | Name | |
|---|---|---|---|
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Product Catalog | Microelectronic Materials Catalog | |
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Technical Data Sheet | CoolTherm MD-140 SP Conductive Adhesive | |
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User Instructions | Electronic Materials Handling Instructions (-40°C Storage Temperature) | |
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Selector Guide | Electronic Materials for LED Applications | |
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Safety Data Sheet | COOLTHERM MD-140 SP |