Thermoset EP-937 Board Level Encapsulant Where to Buy
Product Information
LORD Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
Shelf Life
Shelf life is six months from date of manufacture when stored between 0° and 5°C in original, unopened container. Do not store containers outdoors or in non-ventilated exterior structures. Store product away from heat sources such as ovens or hot plates. Elevated storage temperatures will shorten product's shelf life.
Features and Benefits
Convenient – requires no mixing; provides excellent shelf life stability; prepared under vacuum and contains no entrapped air or solvents.
Environmentally Resistant – provides excellent resistance to thermal shock and moisture.
Fast Cure – quickly cures at 150°C with a void-free, smooth surface.
Outstanding Adhesion – offers a fast elevated temperature cure for outstanding adhesion to a variety of materials.
Uncured Typical Properties*
Appearance | Black Paste |
Viscosity, cps @ 25°C, Spindle 6, 10 rpm | 47,900 |
Specific Gravity | 1.49 |
Gel Time, min @ 150°C | 3 |
Working Life, month @ 25°C | 1 |
Cure Time, min @ 150°C | 20 |
Cured Typical Properties*
Volume Resistivity, ohm-cm @ 25°C | 1 x 1015 |
Coefficient of Linear Thermal Expansion, ppm/°C, below Tg | 45 |
Glass Transition Temperature (Tg), °C | 125 |
Hardness, Shore D | 88 - 94 |
Modulus of Elasticity, GPa | 1 |
Dielectric Constant | 4.0 |
Dissipation Factor | 0.01 |
*Data is typical and not to be used for specification purposes.
Cured data obtained by using using a cure schedule of one hour at 150°C. Choice of cure schedule will vary with the application; user must establish optimum cure schedule.