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LORD Corporation

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Thermoset EP-729 Board Level Encapsulant Where to Buy


Product Information

LORD Thermoset EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.

Shelf Life

Shelf life is six months from date of manufacture when stored between 0°C and 5°C in original, unopened container. Do not store containers outdoors or in non-ventilated exterior structures. Store product away from heat sources such as ovens or hot plates. Elevated storage temperatures will shorten product’s shelf life.

Features and Benefits

Convenient – requires no mixing; provides excellent shelf life stability; prepared under vacuum and contains no entrapped air or solvents.

Environmentally Resistant – provides excellent resistance to thermal shock and moisture.

Fast Cure – quickly cures at 150°C with a void-free, smooth surface.

Outstanding Adhesion – offers a fast elevated temperature cure for outstanding adhesion to a variety of materials.

Uncured Typical Properties*

Appearance Black Paste
Viscosity, cps @ 25°C
Spindle 6, 10 rpm
58,000
Specific Gravity 1.49
Gel Time, min @ 150°C 5
Working Life, month @ 25°C 1
Cure Time, min @ 150°C 30

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C 1 x 1015
Coefficient of Linear Thermal Expansion, ppm/°C 35
Glass Transition Temperature (Tg), °C 140
Hardness, Shore D 88
Modulus of Elasticity, GPa 1
Dielectric Constant 4.0
Dissipation Factor 0.01

*Data is typical and not to be used for specification purposes.
Data obtained by using using a cure schedule of one hour at 150°C. Choice of cure schedule will vary with the application; user must establish optimum cure schedule.

Literature

Download Type Name
Download Technical Data Sheet Thermoset EP-729 Board Level Encapsulant
Download User Instructions Electronic Materials Handling Instructions (5°C Storage Temperature)
Download User Instructions Electronic Materials Handling Instructions (0°C Storage Temperature)

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