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LORD Corporation

With more than 3,100 employees in 26 countries, 19 manufacturing facilities and 10 R&D centers worldwide, we're there for our customers.

Our Company
 
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Electronic Materials

Our experience in electronic materials spans more than 50 years, and we incorporate this vast knowledge in developing solutions for new electronics applications to help ensure our customers' success.

Electronic Materials

We specialize in developing world-class thermal management, potting and encapsulation, gap filling, semiconductor packing, adhesive and thick film materials for demanding applications. Our product portfolio and technical expertise includes multiple chemistries, namely urethanes, epoxies and silicones. This product and expertise diversity allows us to select the chemistry that is the best fit for our customers' performance and cost requirements.

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Products & Solutions

CoolTherm® Thermal Management Materials
Customizable CoolTherm products that remove heat from electronics.
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Potting & Encapsulation Materials
Optimize heat dissipation with high thermal conductivity and low viscosity.
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Semiconductor Packaging
Die attach adhesives, encapsulants, underfills and thermal interface materials for assembly and packaging.
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Thick Film Materials
Durable, electrically conductive products used in electronic applications.
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Why Should You Care About Heat in EV Design?
The electric vehicle (EV) industry is rapidly growing and improving, but one constant remains: the need to combat overheating.
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Thermally Conductive Chemistries: What's the Difference?
Learn about our CoolTherm® thermal management materials: silicones, epoxies, urethanes, and acrylics.
Read post

Resource Center

Product Catalog: Microelectronics
Explore our microelectronics solutions. If you need help choosing one of our standard microelectronic products or if they don’t quite meet your needs, let us help you determine an appropriate solution for your application.
Product Catalog: Potting & Encapsulation
We offer potting & encapsulants that are thermally conductive for applications where you need to remove heat, as well as non-thermally conductive materials.
White Paper: Battery Cooling Performance
Our data shows a clear advantage for liquid-dispensed gap fillers versus thermal gap pads when removing heat from battery modules. Learn from our experts in our latest white paper which compares gap filler and thermal pad performance on a prototype electric vehicle battery module.
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