CoolTherm® EP-6151 Epoxy Adhesive Where to Buy
Product Information
LORD CoolTherm® EP-6151 adhesive is a one-component, aluminum-filled epoxy adhesive designed for use as a thermal interface adhesive for heat sink attachment and other applications requiring good adhesion and heat transfer properties.
Shelf Life
Shelf life is four months from date of manufacture when stored at 5°C in original, unopened container. Syringe must be stored in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
If material is stored at 25°C, shelf life will be shortened to approximately one month.
Features and Benefits
Thermal Stability – provides excellent thermal stability; can be used on parts and devices that experience operating temperatures from -40°C to +150°C.
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat dissipation is required.
Fast Cure – rapidly cures at 121°C and 177°C.
Non-Sag – thixotropic rheology allows shape to be maintained after dispensing.
Chemically Resistant – provides excellent resistance to acids and strong bases.
Uncured Typical Properties*
| Appearance | Gray Paste |
| Viscosity, cps @ 25°C | 750,000 |
| Specific Gravity | 1.50 |
| Gel Time |
10 min @ 121°C 1 min @ 177°C |
| Cure Time, min @ 121°C | 30 |
Cured Typical Properties*
| Thermal Conductivity, W/mk | 0.6 |
| Glass Transition Temperature (Tg), °C | 124 |
|
Hardness, @ 25°C Shore D |
90 |
|
Tensile Strength, psi AL-AL |
3000 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | COOLTHERM EP-6151 | |
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Product Catalog | Microelectronic Materials Catalog | |
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Technical Data Sheet | CoolTherm EP-6151 Epoxy Adhesive | |
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User Instructions | Electronic Materials Handling Instructions (5°C Storage Temperature) |