Showing 11 - 20 of 21
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| Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets | MSDS (US) |
|---|---|---|---|---|---|---|---|
| CoolTherm ® MD-161 Conductive Adhesive |
40,000 |
1.9 |
55 |
 |
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| Thermoset ME-430 Board Level Encapsulant |
317,500 |
135 |
|
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| Thermoset ME-455 Board Level Encapsulant |
19,000 |
135 |
|
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| Thermoset ME-456 Dam Encapsulant |
900,000 - 1,500,000 |
135 |
|
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| CoolTherm ® ME-525 Underfill Encapsulant |
6000 |
0.5 |
120 |
|
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| CoolTherm ® ME-531 Underfill Encapsulant |
4000 |
0.5 |
140 |
|
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| CoolTherm ® ME-543 Underfill Encapsulant |
21,000 |
1.2 |
135 |
|
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| Thermoset™ ME-588 BK Underfill Encapsulant |
|
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| CoolTherm ® MT-220C Thermally Conductive Adhesive | |||||||
| Thermoset™ ME-588 Underfill Encapsulant |
|