Thermoset™ ME-588 BK Underfill Encapsulant Where to Buy
Product Information
LORD Thermoset™ ME-588 BK encapsulant is an anhydride-free, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle overmolding processes.
Thermoset ME-588 BK encapsulant can be fast cured and is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Shelf Life
Shelf life is six months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions** for thawing.
**Handling instructions are available on LORD.com.
Features and Benefits
Jettable – provides low viscosity for high speed jetting dispense.
Self-Filleting – provides surface tension and viscosity flow properties to achieve full coverage without producing bulky fillet on top of device.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling (-40 to +150°C); provides excellent thermal shock performance.
Rapid Flow – formulated to flow consistently without voids while maintaining a fast flow rate; can be used under small or large die with high-density interconnects and under devices with stand-off heights below 25 micron.
Good Adhesion – provides good adhesion to laminate, ceramic, solder mask and metal surfaces.
Device Reliability – provides high Tg and high fracture toughness, reducing the amount of thermally induced stress placed on the solder interconnects.
Uncured Typical Properties*
| Appearance | Black Liquid |
| Viscosity, cps @ 25°C | 15,000 |
| Specific Gravity | 1.54 |
| Gel Time, min @ 120°C | 6 |
| Working Life, hr @ 25°C |
20% viscosity increase = 20 50% viscosity increase = 50 |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | >1 x 1013 |
| Coefficient of Linear Thermal Expansion, ppm/°C |
alpha 1 = 44 alpha 2 = 100 |
| Glass Transition Temperature (Tg), °C | 148 |
| Storage Modulus, MPa | 5027 |
| Dielectric Strength, V/mil | 945 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
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Technical Data Sheet | Thermoset ME-588 BK Underfill Encapsulant | |
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User Instructions | Electronic Materials Handling Instructions (-40°C Storage Temperature) | |
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Safety Data Sheet | THERMOSET ME-588 BK |