Thermoset ME-456 Dam Encapsulant Where to Buy
Product Information
LORD Thermoset ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material designed for use in the encapsulation of wire-bonded or flip chip devices where a dam is needed to restrict flow of a cavity fill encapsulant. It is formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications and minimize the chances of ion-induced corrosion in these devices.
Thermoset ME-456 encapsulant offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces. It can be used in demanding high-end, consumer and automotive applications.
Shelf Life
Shelf life is six months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions for this product for thawing warnings and instructions.
Features and Benefits
High Viscosity – allows easy dispensing around perimeter of encapsulation area.
High Thixotropic Index – material retains dispensed profile, will not self-level and slump before cavity fill encapsulant is applied.
Low Stress – exhibits low shrinkage and stress on components as it cures.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling; provides excellent temperature shock performance.
Fast Cure – quickly cures at 150°C, leaving no pits or voids for a smooth surface.
Uncured Typical Properties*
| Appearance | Black Paste |
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Viscosity, cps @ 25°C Spindle 7, 1 rpm |
900,000 - 1,500,000 |
| Specific Gravity | 1.80 |
| Gel Time, min @ 150°C | 3 - 5 |
| Working Life, hr @ 25°C | 36 |
| Cure Time, min @ 150°C | 30 |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | >1 x 1015 |
| Coefficient of Linear Thermal Expansion, ppm/°C |
alpha 1 = 19 alpha 2 = 60 |
| Glass Transition Temperature (Tg), °C | 135 |
| Moisture Absorption, % | 0.6 |
| Modulus of Elasticity, GPa | 6 |
| Dielectric Constant | 3.6 |
| Dissipation Factor | 0.006 |
| Extractable Ionic Contaminants, ppm |
Chloride = 5 Sodium = 5 Potassium = 1 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
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Safety Data Sheet | THERMOSET ME-456 | |
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Technical Data Sheet | Thermoset ME-456 Dam Encapsulant | |
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User Instructions | Electronic Materials Handling Instructions (-40°C Storage Temperature) | |
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Selector Guide | Electronic Materials for LED Applications | |
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Product Catalog | Microelectronic Materials Catalog |