CoolTherm® ME-531 Underfill Encapsulant Where to Buy
Product Information
LORD CoolTherm® ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.
CoolTherm ME-531 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Shelf Life
Shelf life is six months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions** for thawing.
** Handling instructions are available on LORD.com.
Features and Benefits
Self-Filleting – provides surface tension and viscosity flow properties to achieve full coverage without producing bulky fillet on top of device.
Jettable – provides low viscosity for high speed jetting dispense.
Rapid Flow – formulated to flow consistently without voids while maintaining a fast flow rate; can be used under small dies and under devices with stand-off heights above 25 micron.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling (-40 to +125°C); provides excellent thermal shock performance.
Good Adhesion – provides good adhesion to laminate, ceramic, solder mask and metal surfaces.
Device Reliability – provides high Tg and high fracture toughness, reducing the amount of thermally induced stress placed on the solder interconnects.
Uncured Typical Properties*
| Appearance | Black, Low-viscosity Liquid |
|
Viscosity, cps @ 25°C CP40, 5 rpm |
4000 |
| Specific Gravity | 1.71 |
| Gel Time, min @ 150°C | 6 |
| Working Life, hr @ 25°C | 16 |
| Cure Time |
30 min @ 150°C; or 15 min @ 165°C |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 1 x 1015 |
| Thermal Conductivity, W/mK | 0.5 |
| Coefficient of Linear Thermal Expansion, ppm/°C |
alpha 1 = 21 alpha 2 = 85 |
| Glass Transition Temperature (Tg), °C | 140 |
| Die Shear Strength, psi | 9000 |
| Storage Modulus, MPa | 6000 |
| Moisture Absorption, % | < 0.5 |
| Extractable Ionic Contaminants |
Chloride = < 10 Sodium = < 5 Potassium = < 1 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
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Product Catalog | Microelectronic Materials Catalog | |
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|
Technical Data Sheet | CoolTherm ME-531 Underfill Encapsulant | |
|
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User Instructions | Electronic Materials Handling Instructions (-40°C Storage Temperature) | |
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Safety Data Sheet | CoolTherm ME-531 |