Thermoset™ ME-588 Underfill Encapsulant Where to Buy
Product Information
LORD Thermoset™ ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle over-molding processes.
Thermoset ME-588 encapsulant can be fast cured and is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Shelf Life
Shelf life is six months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions** for thawing.
**Handling instructions are available on LORD.com.
Features and Benefits
Jettable – provides low viscosity for high speed jetting dispense.
Self-Filleting – provides surface tension and viscosity flow properties to achieve full coverage without producing bulky fillet on top of device.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling (-40 to +150°C); provides excellent thermal shock performance.
Rapid Flow – formulated to flow consistently without voids while maintaining a fast flow rate; can be used under small or large die with high-density interconnects and under devices with stand-off heights below 25 micron.
Good Adhesion – provides good adhesion to laminate, ceramic, solder mask and metal surfaces.
Device Reliability – provides high Tg and high fracture toughness, reducing the amount of thermally induced stress placed on the solder interconnects.
Uncured Typical Properties*
| Appearance | Black Liquid |
| Viscosity, cP @ 25°C | 13,000 |
| Specific Gravity | 1.53 |
| Gel Time, minutes @ 120°C | 6 |
| Working Life, hours @ 25°C | 36 |
Cured Typical Properties*
| Coefficient of Linear Thermal Expansion, ppm/°C |
alpha 1 = 32 alpha 2 = 117 |
| Glass Transition Temperature (Tg), °C | 139 |
| Storage Modulus, MPa | 4700 |
| Volume Resistivity, ohm-cm @ 25°C | >1 x 1015 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
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Technical Data Sheet | Thermoset ME-588 Underfill Encapsulant | |
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User Instructions | Electronic Materials Handling Instructions (-40°C Storage Temperature) | |
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Safety Data Sheet | THERMOSET ME-588 |