Thermoset ME-430 Board Level Encapsulant Where to Buy
Product Information
LORD Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications.
Thermoset ME-430 encapsulant offers good adhesion to both laminate and ceramic substrates, and can be used in demanding high-end, consumer printed circuit board and semiconductor applications.
Shelf Life
Shelf life is six months from date of manufacture when stored at -40°C in original, unopened container. Syringe must be maintained at -40°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions** for thawing.
** Handling instructions are available on LORD.com.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during temperature cycling; provides excellent temperature shock performance.
Fast Cure – quickly cures at 150°C, leaving no pits or voids for a smooth surface.
Environmentally Friendly – contains no solvents.
Uncured Typical Properties*
| Appearance | Black Paste |
|
Viscosity, cps @ 25°C Spindle 14, 1 rpm |
317,500 |
| Specific Gravity | 1.80 |
| Gel Time, min @ 150°C | 3.5 - 5.8 |
| Working Life, hr @ 25°C | 24 |
| Cure Time, min @ 150°C | 30 |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 1 x 1015 |
|
Coefficient of Linear Thermal Expansion, ppm/°C below Tg |
19 |
| Glass Transition Temperature (Tg), °C | 135 |
| Hardness, Shore D | 91 - 98 |
| Modulus of Elasticity, GPa | 6 |
| Dielectric Constant | 3.7 |
| Dissipation Factor | 0.006 |
| Extractable Ionic Contaminants, ppm |
Chloride = 5 Sodium = 5 Potassium = 1 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
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Safety Data Sheet | Thermoset ME-430 | |
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Technical Data Sheet | Thermoset ME-430 Board Level Encapsulant | |
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User Instructions | Electronic Materials Handling Instructions (-40°C Storage Temperature) | |
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Product Catalog | Microelectronic Materials Catalog |