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Products and Solutions
Electronic Materials
Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Cure Profile Remove Cure Profile filter 37
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Chemistry 37 Apply Chemistry filter
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Product	Viscosity	Cure Time	Thermal Conductivity	Glass Transition Temperature (Tg)
Thermoset EP-729 Board Level Encapsulant	58,000			140
Thermoset EP-937 Board Level Encapsulant	47,900			125
Thermoset EP-939 Board Level Encapsulant	37,200			125
CoolTherm ® EP-96 Epoxy Adhesive	145,000	30 min @ 121°C; or 10 min @ 177°C	0.6	141
Thermoset MD-130 Adhesive	60,000		0.42	140
CoolTherm ® MD-140 SP Conductive Adhesive	40,000		12	82
CoolTherm ® MD-161 Conductive Adhesive	40,000		1.9	55
Thermoset ME-430 Board Level Encapsulant	317,500			135
Thermoset ME-455 Board Level Encapsulant	19,000			135
Thermoset ME-456 Dam Encapsulant	900,000 - 1,500,000			135

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About Parker LORD

We are a diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions.

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Semiconductor Packaging and Circuit Assembly Products

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