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Products and Solutions
Electronic Materials
Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Product	Viscosity	Cure Time	Thermal Conductivity	Glass Transition Temperature (Tg)
CoolTherm ® EP-6150 Epoxy Adhesive	145,000		0.6
CoolTherm ® EP-6151 Epoxy Adhesive	750,000		0.6	124
CoolTherm ® EP-6960 Conductive Adhesive	150,000		1.1	49
CoolTherm ® EP-6972 Conductive Adhesive
Thermoset 7195-125 Black Epoxy Adhesive	125,000		0.7	140
Thermoset DC-80 Adhesive
Thermoset EP-729 Board Level Encapsulant	58,000			140
Thermoset EP-937 Board Level Encapsulant	47,900			125
Thermoset EP-939 Board Level Encapsulant	37,200			125
CoolTherm ® EP-96 Epoxy Adhesive	145,000	30 min @ 121°C; or 10 min @ 177°C	0.6	141

1 2 3 ›»

About Parker LORD

We are a diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions.

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