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| Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets | MSDS (US) |
|---|---|---|---|---|---|---|---|
| CoolTherm ® EP-301 AD Epoxy Resin |
10,350 |
 |
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| CoolTherm ® EP-636 Epoxy Encapsulant |
50,000 |
180 |
|
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| Thermoset™ Hardener No. 18 |
50 |
|
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| Thermoset™ Hardener No. 67 |
30 |
|
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| Thermoset Hardener No. 70 |
|
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| CoolTherm ® SC-104 Thermally Conductive Silicone Encapsulant |
7000 |
0.8 |
|
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| CoolTherm ® SC-303 Thermally Conductive Silicone Encapsulant |
6000 |
0.9 |
|
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| CoolTherm ® SC-305 Thermally Conductive Silicone Encapsulant |
4000 |
0.7 |
> -100 |
|
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| CoolTherm ® SC-309 Thermally Conductive Silicone Encapsulant |
3600 |
1.0 |
|
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| CoolTherm ® SC-320 Thermally Conductive Silicone Encapsulant |
3.0 |
|