CoolTherm® SC-104 Thermally Conductive Silicone Encapsulant Where to Buy
Product Information
LORD CoolTherm® SC-104 thermally conductive encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. CoolTherm SC-104 encapsulant can be either room temperature cured or heat cured for maximum adhesion.
Shelf Life
Shelf life of each component is nine months when stored at 25°C in original, unopened container. The material must be periodically rotated within its container to maintain maximum shelf life. Settling will occur if not mixed.
CoolTherm SC-104 hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.
Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials.
Environmentally Resistant – provides excellent thermal shock resistance.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
Uncured Typical Properties*
| Mixed Appearance | Gray Liquid |
| Mixed Viscosity, cP @ 25°C | 7000 |
| Mixed Specific Gravity | 2.10 |
| Gel Time, min @ 25°C | 60 |
| Working Life, min @ 25°C | 50 |
| Cure Time |
24 hr @ 25°C; or 25-30 min @ 70°C; or 10-15 min at 100°C |
Cured Typical Properties*
| Thermal Conductivity, W/m·K | 0.8 |
| Coefficient of Linear Thermal Expansion, ppm/°C | 160 |
| Hardness, Shore A | 65 |
| Tensile Strength, MPa (psi) | 3.3 (480) |
| Elongation at Break, % | 45 |
| Moisture Absorption, % | 0.1 |
| Volume Resistivity, ohm-cm @ 25°C | 2.2 x 1015 |
| Dielectric Strength, kV/mm (V/mil) | 17.3 (440) |
| Dielectric Constant, @ 25°C | 3.06 |
| Dissipation Factor, @ 25°C | 0.0075 |
*Data is typical and not to be used for specification purposes.
Cure schedule of 16 hours at 25°C plus 2 hours at 100°C.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | COOLTHERM SC-104 RESIN | |
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| Safety Data Sheet | COOLTHERM SC-104 HARDENER | |
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Technical Data Sheet | CoolTherm SC-104 Thermally Conductive Silicone Encapsulant | |
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Product Catalog | Potting & Encapsulation Materials | |
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Filled Addition-Curing Silicone Encapsulant Handling/Application Notes |