CoolTherm® SC-309 Thermally Conductive Silicone Encapsulant Where to Buy
Product Information
CoolTherm® SC-309 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. CoolTherm SC-309 encapsulant can be either room temperature cured or heat cured for maximum adhesion.
Shelf Life
Shelf life of each component is six months when stored at 25°C in original, unopened container. The material must be periodically rotated within its container to maintain maximum shelf life. Setting will occur if not mixed.
CoolTherm SC-309 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.
Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.
Environmentally Resistant – provides excellent thermal shock resistance.
UL Rated – provides excellent flame retardancy; UL 94 V-O certified.
Typical Properties*
| Mixed Appearance | Light Gray Liquid |
| Mixed Viscosity, cP @ 25°C | 3600 |
| Mixed Specific Gravity | 1.66 |
| Gel Time, min @ 50°C | 5 - 9 |
| Working Life, min @ 25°C | 30 |
| Cure Time |
24 hr @ 25°C; or 15 min @ 100°C; or 10 min @ 120°C |
Cured Typical Properties*
| Thermal Conductivity, W/m·K | 1.0 |
| Coefficient of Linear Thermal Expansion, ppm/°C | 190 |
| Hardness, Shore A | 45 |
| Tensile Strength, MPa (psi) | 0.34 (50) |
| Moisture Absorption, % | < 0.5 |
| Volume Resistivity, ohm-cm @ 25°C | 4.3 x 1013 |
| Dielectric Strength, kV/mm (V/mil) | 23.6 (600) |
| Dielectric Constant, @ 25°C | 4.0 |
| Dissipation Factor, % @ 25°C | 0.004 |
*Data is typical and not to be used for specification purposes.
Cure schedule of 24 hours at 25°C plus 2 hours at 100°C.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | CoolTherm SC-309 Resin | |
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| Safety Data Sheet | CoolTherm SC-309 Hardener | |
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Product Catalog | Potting & Encapsulation Materials | |
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Technical Data Sheet | CoolTherm SC-309 Thermally Conductive Silicone Encapsulant | |
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Filled Addition-Curing Silicone Encapsulant Handling/Application Notes | ||
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Selector Guide | Electronic Materials for LED Applications | |
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White Paper | Thermally Conductive Potting Compounds Enable Higher Power Density Electronics |
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