CoolTherm® SC-320 Thermally Conductive Silicone Encapsulant Where to Buy
Product Information
CoolTherm® SC-320 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
Shelf Life
Shelf life of each component is nine months when stored at 25°C in original, unopened container.
CoolTherm SC-320 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Features and Benefits
Low Stress - exhibits low shrinkage and stress on components as it cures.
Durable - composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.
Low Viscosity - maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials.
Environmentally Resistant - provides excellent thermal shock resistance.
UL Rated - provides excellent flame retardancy; UL 94 V-0 certified; approved for use in PDG-H2, Table V insulation constructions (Class H – 180°C).
Uncured Typical Properties*
| Mixed Appearance | Light Pink Liquid |
| Mixed Viscosity, cP @ 25°C | 22,000 |
| Mixed Specific Gravity | 3.1 |
| Gel Time, minutes @ 121°C | 2 - 5 |
| Working Life, minutes @ 25°C | 40 |
| Cure Time |
24 hours @ 25°C; or 60 minutes @ 125°C |
Cured Typical Properties*
| Thermal Conductivity, W/m·K | 3.0 |
| Coefficient of Linear Thermal Expansion, ppm/°C | 110 |
| Hardness, Shore A | 54 |
| Tensile Strength, MPa (psi) | 2.16 (313) |
| Elongation at Break, % | 15 |
| Moisture Absorption, % | < 0.1 |
| Volume Resistivity, ohm-cm @ 25°C | > 1 x 1014 |
| Dielectric Constant, @ 25°C | 6 |
| Dissipation Factor, @ 25°C | < 0.01 |
| Extractable Ionic Contaminants |
Chloride = <10 Sodium = <10 Potassium = <10 Ammonium = <10 Bromide = <10 Sulfate = <10 |
*Data is typical and not to be used for specification purposes.
Cure schedule of 60 minutes at 125°C.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | COOLTHERM SC-320 RESIN | |
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| Safety Data Sheet | COOLTHERM SC-320 HARDENER | |
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Technical Data Sheet | CoolTherm SC-320 Thermally Conductive Silionce Encapsulant | |
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Selector Guide | Electronic Materials for LED Applications | |
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Product Catalog | Potting & Encapsulation Materials | |
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White Paper | How Proper Application of Thermally Conductive Materials Will Improve Motor Power Density | |
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White Paper | Thermally Conductive Potting Compounds Enable Higher Power Density Electronics | |
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Filled Addition-Curing Silicone Encapsulant Handling/Application Notes | ||
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Product Brochure/Bulletin/Sell Sheet | Thermal Management Materials for the Oil & Gas Industry |
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