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LORD Corporation

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  4. Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Product Viscosity Mixed Viscosity Cure Time Thermal Conductivity Glass Transition Temperature (Tg) Technical Data Sheets MSDS (US)
Thermoset™ ME-588 BK Underfill Encapsulant Download
CoolTherm ® MT-220C Thermally Conductive Adhesive
Thermoset™ ME-588 Underfill Encapsulant Download
CoolTherm ® MD-140 Conductive Adhesive

36,000

12

82

 Download
CoolTherm ® MT-125 Thermally Conductive Adhesive

100,000

2.35

123

 Download
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