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Products and Solutions
Electronic Materials
Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Product	Viscosity	Thermal Conductivity	Glass Transition Temperature (Tg)
CoolTherm ® ME-555 Underfill Encapsulant	5500	0.5	125
Thermoset™ ME-588 BK Underfill Encapsulant
Thermoset™ ME-588 Underfill Encapsulant

About Parker LORD

We are a diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions.

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