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Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets | MSDS (US) |
---|---|---|---|---|---|---|---|
Thermoset EP-729 Board Level Encapsulant |
58,000 |
140 |
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Thermoset™ ME-588 Underfill Encapsulant |
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