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Electronic Materials
Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Product	Viscosity	Thermal Conductivity	Glass Transition Temperature (Tg)
Thermoset EP-729 Board Level Encapsulant	58,000		140
Thermoset™ ME-588 Underfill Encapsulant
CoolTherm ® MD-140 Conductive Adhesive	36,000	12	82
CoolTherm ® UR-2000 Thermally Conductive Urethane Gap Filler

About Parker LORD

We are a diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions.

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