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Product | Viscosity | Mixed Viscosity | Cure Time | Thermal Conductivity | Glass Transition Temperature (Tg) | Technical Data Sheets | MSDS (US) |
---|---|---|---|---|---|---|---|
Thermoset EP-729 Board Level Encapsulant |
58,000 |
140 |
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CoolTherm ® SC-1200 Thermally Conductive Silicone Gap Filler |
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CoolTherm ® MD-140 Conductive Adhesive |
36,000 |
12 |
82 |
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