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Products and Solutions
Electronic Materials
Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Product	Viscosity	Cure Time	Thermal Conductivity	Glass Transition Temperature (Tg)
CoolTherm ® MG-120 Thermally Conductive Gel	400,000	60 min @ 120°C; or 30 min @ 150°C	2.8	-121
CoolTherm ® MG-121 Thermally Conducive Gel	60,500		2.3	-121
CoolTherm ® MG-122 Thermally Conductive Gel	60,000		2.8	-121
CoolTherm ® MG-133 Thermally Conductive Gel	128,400		3.6	-110
CoolTherm ® SC-1200 Thermally Conductive Silicone Gap Filler
CoolTherm ® UR-2002 Thermally Conductive Urethane Gap Filler
CoolTherm ® SC-1600 Thermally Conductive Silicone Gap Filler
CoolTherm ® SC-3500 Thermally Conductive Silicone Gap Filler

About Parker LORD

We are a diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions.

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Semiconductor Packaging and Circuit Assembly Products

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