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Products and Solutions
Electronic Materials
Semiconductor Packaging And Circuit Assembly

Semiconductor Packaging and Circuit Assembly Products

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Product	Viscosity	Thermal Conductivity	Glass Transition Temperature (Tg)
CoolTherm ® ME-525 Underfill Encapsulant	6000	0.5	120
CoolTherm ® ME-531 Underfill Encapsulant	4000	0.5	140
CoolTherm ® ME-543 Underfill Encapsulant	21,000	1.2	135
CoolTherm ® ME-555 Underfill Encapsulant	5500	0.5	125
CoolTherm ® SC-322 Thermally Conductive Adhesive	65,000	1.7

About Parker LORD

We are a diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions.

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Semiconductor Packaging and Circuit Assembly Products

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