Thermoset UR-325 Urethane Encapsulant Where to Buy
Product Information
LORD Thermoset UR-325 encapsulant is a two-component urethane system designed for encapsulating delicate, pressure or shock sensitive electronic components. Thermoset UR-325 encapsulant cures to a low modulus material using room temperature cure.
Shelf Life
Shelf life is six months for Thermoset UR-325 resin and one year for Thermoset UR-325 hardener from date of manufacture when stored in a dry environment at 25°C in original, unopened container.
After opening, protect each component from excessive moisture by using dry nitrogen as an inert cover.
If stored or shipped at cooler temperatures, Thermoset UR-325 hardener may crystallize. If crystals appear, gently warm hardener at 32-46°C and periodically stir as it is liquefying. Heating period should not exceed three hours as excessive heating will cause dimerization.
Features and Benefits
Good Adhesion – provides good adhesion to a variety of materials.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -90°C to +130°C.
Environmentally Resistant – provides excellent thermal shock resistance; exhibits exceptional hydrolytic stability.
Typical Properties*
Mixed Appearance | Black Liquid |
Mixed Viscosity, cps @ 25°C | 4000 |
Mixed Specific Gravity | 0.98 |
Working Life, min @ 25°C | 20-25 |
Cure Time, days @ 25°C | 3-4 |
Cured Typical Properties*
Volume Resistivity, ohm-cm @ 25°C | 3 x 1015 |
Thermal Conductivity, W/mK | 0.2 |
Coefficient of Linear Thermal Expansion, ppm/°C | 240 x 10-6 |
Glass Transition Temperature (Tg), °C | -76 |
Hardness, Shore A | 60 |
Tensile Strength, psi | 770 |
Elongation at Break, % | 225 |
Dielectric Strength, V/mil @ 25°C | 650 |
Dielectric Constant, @ 25°C 1 MHz |
2.9 |
Dissipation Factor, @ 25°C 1 MHz |
0.028 |
*Data is typical and not to be used for specification purposes.
Cure schedule of 16 hours at 25°C plus 2 hours at 100°C.