Thermoset™ UR-105 Urethane Encapsulant Where to Buy
Product Information
Thermoset™ UR-105 urethane encapsulant is a two-component system designed for encapsulation of fragile, pressure sensitive microelectronic components. Thermoset UR-105 encapsulant cures to a soft, flexible gel using either room temperature or heat cure.
Shelf Life
Shelf life of each component is one year from date of manufacture when stored at 25°C in original, unopened container.
After opening, protect each component from excessive moisture by installing desiccant cartridges and/or using dry nitrogen as an inert cover.
If stored or shipped at cooler temperatures, Thermoset UR-105 hardener may crystallize. If crystals appear, gently warm hardener at 30-50°C to melt crystals before mixing with resin. Limit heating period to less than three hours as excessive heating will cause dimerization.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
Excellent Adhesion – provides excellent pressure-sensitive adhesion to most substrates.
Environmentally Resistant – provides excellent thermal shock resistance; exhibits exceptional hydrolytic stability.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -80°C to +130°C.
Uncured Typical Properties*
Mixed Appearance | Black Paste |
Mixed Viscosity, cps @ 25°C | 1500 |
Mixed Specific Gravity | 0.94 |
Gel Time, hr @ 25°C | 2 |
Working Life, min @ 25°C | 30 |
Cure Time, hr @ 25°C | 24 |
Cured Typical Properties*
Volume Resistivity, ohm-cm @ 25°C | 3 x 1016 |
Hardness, Shore A | 25 |
Tensile Strength, MPa | 0.83 |
Elongation at Break, % | 130 |
Storage Modulus, MPa | 0.45 |
Moisture Absorption, % @ 25°C | 0.18 |
Dielectric Constant, @ 25°C | 3.08 |
Dissipation Factor, @ 25°C | 0.017 |
*Data is typical and not to be used for specification purposes.