Thermoset SC-400 Silicone Encapsulant Where to Buy
Product Information
LORD Thermoset SC-400 silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. Thermoset SC-400 encapsulant system cures to an extremely soft, gel-like consistency using either room temperature or heat cure. This encapsulant system contains a UV dye to aid inspection.
Shelf Life
Shelf life of each component is six months from date of manufacture when stored at 25°C in original, unopened container.
Thermoset SC-400 hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Features and Benefits
Low Stress - exhibits low shrinkage and stress on components as it cures.
Excellent Adhesion - provides excellent adhesion to most substrates without the use of a primer.
Durable - composed of an addition-curing polymer that will not depolymerize when heated in confined spaces.
Insulative - provides excellent electrical insulation properties; provides thermal, mechanical and vibration damping.
UV Fluorescence - allows material to fluoresce or glow when exposed to a UV light source; helps ensure proper encapsulation of component.
Uncured Typical Properties*
| Mixed Appearance | Clear Liquid |
| Mixed Viscosity, cps @ 25°C | 160 |
| Mixed Specific Gravity | 0.99 |
| Gel Time, min @ 25°C | 25 |
| Working Life, min @ 25°C | 15 |
| Cure Time, min @ 25°C | 90 |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 9.9 x 1014 |
| Thermal Conductivity, W/mK | 0.2 |
| Coefficient of Linear Thermal Expansion, ppm/°C @ 25°C | 326 |
| Glass Transition Temperature (Tg), °C | -110 |
| Hardness | Soft Gel |
| Storage Modulus, MPa | 2.75 x 10-3 |
| Dielectric Constant, @ 25°C | 2.7 |
| Dissipation Factor, @ 25°C | 0.005 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | THERMOSET SC-400 RESIN | |
|
| Safety Data Sheet | THERMOSET SC-400 HARDENER | |
|
|
Technical Data Sheet | Thermoset SC-400 Silicone Encapsulant | |
|
|
White Paper | Thermally Conductive Potting Compounds Enable Higher Power Density Electronics | |
|
|
Unfilled Addition-Curing Silicone Encapsulant Handling/Application Notes |