Thermoset™ LS 213-9 Epoxy Encapsulant Where to Buy
Product Information
Thermoset™ LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical laminations and potting applications. It can also be used as a reworkable underfill encapsulant.
Shelf Life
Shelf life is four months when stored refrigerated at 5°C in original, unopened container.
Features and Benefits
Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
Excellent Electrical Stability – provides excellent dielectric properties where high electrical dissipation is required.
Environmentally Resistant – provides good resistance to moisture.
Uncured Typical Properties*
| Appearance | Amber Liquid |
| Viscosity, cP @ 25°C | 2800 |
| Specific Gravity | 1.13 |
| Solids Content by Weight, % | 100 |
| Working Life, month @ 25°C | 3 |
| Cure Time |
2 hours @ 120°C; or 5 hours @ 104°C; or 8 hours @ 93°C |
Cured Typical Properties*
| Thermal Conductivity, W/m∙K | 0.1 |
| Glass Transition Temperature (Tg), °C | 80 |
| Hardness, Shore D | 85 |
| Tensile Strength, MPa (psi) | 41.4 (6005) |
| Volume Resistivity, ohm-cm | 2 x 1015 |
| Dielectric Strength, kV/mm (V/mil) | 18.9 (480) |
| Dielectric Constant | 3.4 |
| Dissipation Factor | 0.22 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
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Technical Data Sheet | Thermoset LS 213-9 Epoxy Encapsulant | |
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Safety Data Sheet | Thermoset LS213-9 | |
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Product Catalog | Potting & Encapsulation Materials | |
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Product Catalog | Microelectronic Materials Catalog | |
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User Instructions | Electronic Materials Handling Instructions (5°C Storage Temperature) |
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