Thermoset ES-100 Epoxy Encapsulant Where to Buy
Product Information
LORD Thermoset ES-100 epoxy encapsulant is a two-component epoxy system designed specifically for encapsulation of intricate electrical and electronic components used in automotive, marine and heavy industrial applications. Thermoset ES-100 encapsulant maintains its flexibility and low modulus characteristics after thermal aging, making it an excellent choice for potting or encapsulating delicate and pressure-sensitive electronic components.
Shelf Life
Shelf life of each component is one year from date of manufacture when stored in a well ventilated area at 25°C in original, unopened container.
Features and Benefits
Low Viscosity – maintains low viscosity for ease of void-free component encapsulation.
Low Stress – exhibits low shrinkage and stress on components as it cures.
Chemically Resistant – provides excellent resistance to marine engine compartment fluids and automotive under-the-hood fluids.
Environmentally Resistant – provides excellent resistance to moisture and humidity; exhibits good hydrolytic stability; maintains flexibility in extremely harsh environments and temperatures.
Uncured Typical Properties*
Mixed Appearance | Black Liquid |
Mixed Viscosity, cps @ 25°C | 1200 |
Mixed Specific Gravity | 1.00 |
Gel Time, min @ 80°C | 60 |
Working Life, hr @ 25°C | 12 - 16 |
Cure Time, hr @ 80°C | 3-4 |
Cured Typical Properties*
Volume Resistivity, ohm-cm @ 25°C | 1 x 1011 |
Coefficient of Linear Thermal Expansion, ppm/°C | 270 |
Glass Transition Temperature (Tg), °C | -55 |
Hardness, Shore OO | 70 |
Tensile Strength, MPa | 0.44 |
Elongation at Break, % | 122 |
Moisture Absorption, %, 24-hour soak @ 25°C | 0.28 |
Dielectric Strength, V/mil | 400 |
Dielectric Constant | 4.0 |
Dissipation Factor | 0.13 |
*Data is typical and not to be used for specification purposes.