Thermoset™ EP-954 Epoxy Encapsulant
Product Information
Thermoset™ EP-954 epoxy encapsulant is a two-component, filled epoxy system designed for electrical and electronic applications requiring high operating temperatures. Thermoset EP-954 encapsulant provides a semi-rigid epoxy system for use in applications where high thermal shock is expected. With preheating, encapsulant can be used for vacuum impregnation applications.
Shelf Life
Shelf life of each component is six months from date of manufacture when stored at 25°C in original, unopened container. Each component must be periodically rotated within its container to prevent settling.
Features and Benefits
High Temperature Electrical Performance – exhibits excellent electrical properties at operating temperature up to 155°C.
Environmentally Resistant – provides excellent resistance to thermal shock; provides protection of electrical devices exposed to harsh environmental conditions.
Durable – exhibits very low weight loss over extended periods at elevated temperatures.
Uncured Typical Properties*
Mixed Appearance | Black Liquid |
Mixed Viscosity, cps @ 25°C | 20,000 |
Mixed Specific Gravity, @ 25°C | 1.41 |
Gel Time, mintues @ 121°C | 35 |
Working Life, days @ 25°C | 2-3 |
Cured Typical Properties*
Volume Resistivity, ohm-cm @ 25°C | 8.0 x 1015 |
Coefficient of Linear Thermal Expansion, ppm/°C | 68 |
Hardness, Shore D | 77 |
Tensile Strength, psi | 2700 |
Moisture Absorption, @ 25°C | 0.26 |
Dielectric Strength, V/mil | 380 |
Dielectric Constant, @ 25°C | 3.4 |
Dissipation Factor, @ 25°C | 0.017 |
*Data is typical and not to be used for specification purposes.
Cure schedule of 2 hours at 120°C.