Thermoset 300/65 Epoxy System Where to Buy
Product Information
LORD Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Handling and cured properties of the two-component epoxy system are dependent on the hardener used with Thermoset 300 epoxy resin.
Shelf Life
Shelf life of Thermoset 300 resin is one year from date of manufacture when stored at 25°C in original, unopened container. The material must be periodically rotated within its container to minimize settling.
Shelf life of Thermoset Hardener No. 65 is one year from date of manufacture when stored in a well ventilated area at 25°C in original, unopened container.
Features and Benefits
Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
Excellent Appearance – cures to a high gloss surface, free of “blush” or “sweat-out”.
Environmentally Resistant – high surface hardness provides good impact and mar resistance.
Moisture Insensitive – cured properties obtained even when cured in high humidity environments.
Typical Properties*
| Mixed Viscosity, cps @ 25°C | 7000 |
|
Working Life, min @ 25°C (200g) |
60 |
| Cure Time, hr @ 25°C | 24 |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 3x1015 |
| Hardness, Shore D | 90 |
| Tensile Strength, MPa @ 25°C | 51.7 |
| Elongation at Break, % | 3.2 |
|
Moisture Absorption, % 24 hours @ 25°C |
0.12 |
| Dielectric Strength, V/mil | 370 |
|
Dielectric Constant, 1 MHz @ 25°C |
4.0 |
|
Dissipation Factor, 1 MHz @ 25°C |
0.025 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Technical Data Sheet | Thermoset 300 Epoxy Resin | |
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| Safety Data Sheet | THERMOSET 300 RESIN | |
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| Technical Data Sheet | Thermoset Hardener No. 65 | |
|
| Safety Data Sheet | THERMOSET HARDENER NO. 65 | |
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Product Catalog | Potting & Encapsulation Materials |