Gels are designed for applications where a thermal interface material with adhesion and rework capabilities are required. Our gels are formulated to inhibit bleed, seperation and pump-out that are typically observed in other thermal interface materials. These products provide efficient heat transfer from flip chip microprocessors, plastic pin-grade arrays (PPGAs), ball grid arrays (BGAs), microBGAs, digital signal processing chips (DSP), graphic accelerator chips and other high wattage electronic components. Gels can be applied manually or automatically with precision printing or dispensing.
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LORD Corporation
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Gels & Greases
CoolTherm thermally conductive one component adhesives, gels and greases are designed to provide efficient heat transfer from microprocessors to heat spreaders and heat sinks. The capability of precision dispensing, flexible bond-line and good wetting is ideal to accommodate a range of component sizes, gaps and materials.
Gels
Greases
Greases are designed for applications where a thermal interface material is required and where the heat sink may later need to be easily removed from the device. The thixotropic character or these greases hold the heat sink in place until it can be mechanically attached. Our greases can be used with a variety of devices including flip chip microprocessors, plastic pin-grade arrays (PPGAs), ball grid arrays (BGAs), microBGAs, digital signal processing chips (DSP), graphic accelerator chips, and high-speed memory devices.