LORD® 975-1052 Epoxy Encapsulant Where to Buy
Product Information
LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. LORD 975-1052 encapsulant provides a semi-rigid epoxy system for use in applications where thermal shock is expected.
Shelf Life
Shelf life of each component is six months when stored at 25°C in original, unopened container.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Room Temperature Cure – suitable for curing at room temperature; may be mildly heat cured (43-60°C) to expedite cure.
Low Exotherm – exhibits low exothermic heat rise during room temperature cure, minimizing affect on heat-sensitive components.
Environmentally Resistant – provides excellent resistance to mechanical and thermal shock; retains flexibility even after heat aging.
Uncured Typical Properties*
| Mixed Appearance | Black Liquid |
| Mixed Viscosity, cP @ 25°C | 20,000 |
| Mixed Specific Gravity | 1.54 |
| Gel Time, minutes @ 25°C | 35-45 |
| Working Life, minutes @ 25°C | 15-20 |
| Cure Time, hours @ 25°C | 24 |
Cured Typical Properties*
| Coefficient of Linear Thermal Expansion, ppm/°C | 70 |
| Hardness, Shore D | 80 |
| Tensile Strength, MPa (psi) | 40 (5802) |
| Volume Resistivity, ohm-cm @ 25°C | 1 x 1015 |
| Dielectric Strength, kV/mm (V/mil) | 15 (381) |
| Dielectric Constant, @ 25°C | 4.2 |
| Dissipation Factor, @ 25°C | 0.03 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | LORD 975-1052 A Black | |
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Safety Data Sheet | LORD 975-1052 B | |
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Technical Data Sheet | LORD 975-1052 Epoxy Encapsulant |