CoolTherm® TC-2002 Thermally Conductive Structural Adhesive Where to Buy
Product Information
CoolTherm® TC-2002 adhesive is a two-component adhesive system designed for use in structural bonding applications which require thermal conductivity with high bond strength.
Shelf Life
Shelf life of each component is six months when stored at 25°C in original, unopened container.
Features and Benefits
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat dissipation is required.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -65°C to +100°C.
Low Coefficient of Thermal Expansion – minimizes the possibility of cracking during wide temperature cycling.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
Electrically Isolative – provides good isolation for managing current corrosion.
Typical Properties*
Mixed Appearance | Tan Paste |
Mixed Viscosity, cP @ 25°C | 500,000 |
Mixed Specific Gravity | 1.67 |
Working Life, minutes @ 25°C | 7-8 |
Cure Time, hours @ 25°C | 2-3 |
Cured Typical Properties*
Thermal Conductivity, W/m·K | 1.0 |
Glass Transition Temperature (Tg), °C | 85 |
Hardness, Shore D |
73 |
Lap Shear Strength, MPa (psi) @ 25°C Aluminum |
15.86 (2300) |
Elongation at Break, % | 5 |
Dielectric Strength, kV/mm (V/mil) | 19.0 (482.6) |
*Data is typical and not to be used for specification purposes.