CoolTherm® EP-6035 Epoxy Encapsulant Where to Buy
Product Information
CoolTherm® EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.
Shelf Life
Shelf life of each component is one year when stored at 25°C in original, unopened container.
Features and Benefits
Low Viscosity – maintains low viscosity for complete and void-free encapsulation.
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.
Electrically Insulative – provides excellent high voltage insulation.
Low Exotherm – exhibits low exotherm heat rise during room temperature cure.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from-65°C to +155°C.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
Typical Properties*
| Mixed Appearance | Black Liquid |
| Mixed Viscosity, cP @ 25°C | 12,000 |
| Mixed Specific Gravity | 1.57 |
| Working Life, hours @ 25°C | 2 |
| Cure Time |
24 hours @ 25°C; or 2 hours @ 65°C |
Cured Typical Properties*
| Thermal Conductivity, W/m·K | 1.0 |
| Coefficient of Linear Thermal Expansion, ppm/°C | 35 |
| Hardness, Shore D | 75 |
| Tensile Strength, MPa (psi) | 34.5 (5000) |
| Elongation at Break, % | 5.0 |
| Volume Resistivity, ohm-cm @ 25°C | 1 x 1014 |
| Dielectric Strength, kV/mm (V/mil) | 18.7 (475) |
| Dielectric Constant | 4.1 |
| Dissipation Factor | 0.025 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | COOLTHERM EP-6035 BLACK RESIN | |
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| Safety Data Sheet | CoolTherm EP-6035 Hardener | |
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Technical Data Sheet | CoolTherm EP-6035 Epoxy Encapsulant | |
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Product Catalog | Potting & Encapsulation Materials |