CoolTherm® EP-6007 BLK/6010 Epoxy System Where to Buy
Product Information
LORD CoolTherm® EP-6007 BLK/6010 epoxy system is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.
Shelf Life
Shelf life of each component is one year from date of manufacture when stored at 25°C in original, unopened container.
Features and Benefits
High Thermal Conductivity – provides high thermal conductivity for applications where superior heat transfer is required.
Electrically Insulative – provides excellent high voltage insulation.
Low Exotherm – exhibits low exotherm heat rise during room temperature cure.
Broad Temperature Range – can be used on parts and devices that experience operating temperatures from -55°C to +130°C.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified; meets requirements of Military Specifications MIL T-27 and MIL I-16923.
Typical Properties*
| Working Life, hr @ 25°C | 2 |
| Cure Time, hr @ 25°C | 12 - 16 |
Cured Typical Properties*
| Volume Resistivity, ohm-cm @ 25°C | 2 x 1016 |
| Thermal Conductivity, W/mK | 0.6 |
| Coefficient of Linear Thermal Expansion, ppm/°C |
alpha 1 = 47 alpha 2 = 122 |
| Glass Transition Temperature (Tg), °C | 54 |
| Hardness, Shore D | 85 |
| Tensile Strength, psi @ 25°C | 8400 |
| Elongation at Yield, % | 0.7 |
| Moisture Absorption, %, 10 days @ 25°C | 0.4 |
| Linear Shrinkage, in/in | 0.002 |
| Dielectric Strength, V/mil | 490 |
| Dielectric Constant, @ 25°C | 4.3 |
| Dissipation Factor, @ 25°C | 0.02 |
*Data is typical and not to be used for specification purposes.
Literature
| Download | Type | Name | |
|---|---|---|---|
| Safety Data Sheet | CoolTherm EP-6007 Black | |
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| Technical Data Sheet | CoolTherm EP-6007 BLK Epoxy Resin | |
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| Safety Data Sheet | CoolTherm EP-6010 Hardener | |
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| Technical Data Sheet | CoolTherm EP-6010 Hardener | |
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Product Catalog | Potting & Encapsulation Materials |