BERGQUIST GAP PAD TGP 2200SF
功能与优点
BERGQUIST GAP PAD TGP 2200SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. BERGQUIST GAP PAD TGP 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. BERGQUIST GAP PAD TGP 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework.
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