BERGQUIST GAP PAD TGP 1000VOUSB
功能与优点
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
- 导热性能：1.0 W/m-K
- 高顺应性，低硬度
- “类凝胶”模量
- 减小形变
文件和下载
技术信息
| Carrier Type | Reinforcement Carrier: Fiberglass |
| Standard Thickness | 0.5 - 3.17 mm |
| Thermal Conductivity | 1 W/mK |
| Usage Temperature | -60 - 200 °C |
| Young's Modulus | 55 KPa |
| 技术 | 硅 |
| 颜色 | 黑色 |