BERGQUIST HI FLOW THF 1000F-AC
功能与优点
BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material
BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. BERGQUIST HI FLOW THF 1000F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 1000F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. BERGQUIST HI FLOW THF 1000F-AC requires pressure from the assembly to cause material flow. The HI-FLOW coatings resist dripping in vertical orientation.The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact BERGQUIST Product Management for applications that are less than 0.07'' square.
- 热阻：0.10°C-in2/W（@25 psi）
- 可通过手动或自动的方式，点胶至室温下的散热器表面
- 增强基材，表面涂层
- Soft, thermally conductive 55°C phase change compound
文件和下载
技术信息
| Carrier Film Thickness | 0.38 |
| Flame Rating | V-0 |
| Phase Change Temperature | 55 |
| Phase Change Temperature Unit | °C |
| Standard Thickness | 0 - 0 in. |
| Thermal Conductivity | 1 W/mK |
| Usage Temperature | 120 °C |
| 颜色 | 黑色 |