BERGQUIST GAP PAD TGP 2000SF
功能与优点
BERGQUIST GAP PAD TGP 2000SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2000SF is a silicone-free insulating material. Silicone-sensitive applications benefit from this fiberglass-reinforced gap filling material, which combines electrical isolation with exceptional thermal performance (2.0 W/mK). While highly thermally conductive, the material is exceptionally soft and more compliant than other silicone-free materials. BERGQUIST GAP PAD TGP 2000SF is capable of conforming to the most demanding contours while applying little stress on component leads.
- 导热性能：2 W/m-K
- 自带粘性，可降低界面热阻，便于装配
- 对复杂表面具有高顺应性，可保持结构完整，对脆弱元件引线几乎不产生应力
- 增强型玻璃纤维，抗穿刺，抗剪切，抗撕裂
文件和下载
技术信息
| Carrier Type | Reinforcement Carrier: Fiberglass |
| Standard Thickness | 0.25 - 3.17 mm |
| Thermal Conductivity | 2 W/mK |
| Usage Temperature | -60 - 125 °C |
| Young's Modulus | 228 KPa |
| 技术 | 硅 |
| 颜色 | 绿色 |