BERGQUIST GAP PAD TGP 2202SF
功能与优点
BERGQUIST GAP PAD 2202SF, Silicone-Free, High Performance Thermally Conductive, Fiberglass Carrier, Polymer Pad
BERGQUIST® GAP PAD® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The BERGQUIST GAP PAD 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.BERGQUIST GAP PAD 2202SF is specifically designed for silicone-sensitive applications. The material's construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer.Options and ConfigurationsStandard sheet size - 9" x 18" or custom configurationStandard thickness available - 0.010", 0.023", 0.030", 0.040", 0.045", 0.060", 0.080", 0.100", 0.125"Custom made configurations available upon request
- Thermal conductivity: 2.0 W/m-K
- Silicone-free formulation
- Minimal compression set
- 0.5 mil film provides tack-free surface
文件和下载
技术信息
| Density | 2.8 g/cc |
| Dielectric Constant (1 MHz) | 0.006 |
| Flame Rating | V-0 |
| Shore Hardness Durometer | 70 |
| Shore Hardness Scale | OO |
| Standard Thickness | 0.01 - 0.125 in. |
| Temperature | -40 - 125 °C |
| Thermal Conductivity | 2 W/mK |
| Volume Resistivity | 10 Ohm m |
| 颜色 | 灰色 |